Micro Powder
Silicon Carbide Powder
Precision PSD from F8 to F1500
The finest form of SiC—precision-milled, air-classified, and laser-verified. Available in Black and Green, with tight particle size distribution control for wire-saw cutting, precision lapping, and advanced industrial applications.
SiC Lump
Raw furnace blocks
≥50 mm
SiC Grain
Crushed coarse grains
1–5 mm
SiC Grit
FEPA-graded abrasive
0.1–1 mm
SiC Powder
Micro-powders
F8–F1500
Two Powder Options
Black SiC Powder vs Green SiC Powder
Both powder types share precision PSD control, but differ in purity, hardness, cost, and optimal application range.
Cost-Effective Performance
60–98% SiC · General abrasive, refractory & metallurgical
BEST FOR
Bonded/coated grinding wheels · Tap hole clay · Crucibles & kiln furniture · Steel deoxidation · Cement kiln linings · General polishing
High-Purity Precision
97–99.5% SiC · Semiconductor, wire-saw & precision lapping
BEST FOR
Bonded/coated grinding wheels · Tap hole clay · Crucibles & kiln furniture · Steel deoxidation · Cement kiln linings · General polishing
Black SiC Powder — Chemical Composition by Grade
Purity grades from 60# (metallurgical) to 98# (precision abrasive). Higher purity = tighter F.C. and Fe₂O₃ limits.
| Grade | SiC (%) | F.C. (%) | Fe₂O₃ (%) | Primary Application |
|---|---|---|---|---|
| 60# | 60 | 15–20 | ≤3.5 | Metallurgical deoxidation |
| 65# | 65 | 15–20 | ≤3.5 | Metallurgical additive |
| 70# | 70 | 15–20 | ≤3.5 | Steel deoxidation |
| 75# | 75 | 15–20 | ≤3.5 | Metallurgical / refractory |
| 80# | 80 | ≤3–6 | ≤3.5 | Refractory castables |
| 85# | 85 | ≤2.5 | ≤3.5 | Refractory / bonded abrasive |
| 90# | 90 | ≤1.0 | ≤1.2 | Bonded abrasives |
| 95# | 95 | ≤0.6 | ≤1.2 | Precision abrasive |
| 97# | 97 | ≤0.3 | ≤1.2 | Precision lapping |
| 98# | 98 | ≤0.3 | ≤0.8 | Wire-saw / semiconductor |
Particle size range: F8–F1500, P8–P1500. Custom grades available on request.
Precision Process
PSD Control: From Milling to Verification
Four-layer quality system ensures tight particle size distribution—critical for wire-saw cutting and precision lapping applications.
Precision Milling
Ball mills & jet mills achieve target fineness. Wet or dry milling selected per grade requirements.
Air Classification
Closed-loop classification separates oversize particles. In-line laser PSD measurement adjusts parameters in real time.
Magnetic Separation
Removes iron contamination from milling equipment. Critical for semiconductor and high-purity applications.
Laser PSD Verification
Final laser PSD analysis confirms D50, D90, and D10 values. Morphology inspection and density checks per batch.
Micro Powder Standard Comparison
Cross-reference of JIS, GB W-standard, and ISO P-grit micro powder specifications for SiC powder selection.
| # | JIS R6001 | GB W-Standard | ISO P Grit |
|---|---|---|---|
| 1 | #240 | W63 | P240 |
| 2 | #280 | — | P280 |
| 3 | #320 | W50 | P320 |
| 4 | #360 | W40 | P360 |
| 5 | #400 | — | P400 |
| 6 | #500 | W28 | P500 |
| 7 | #600 | — | P600 |
| 8 | #700 | W20 | P800 |
| 9 | #800 | — | P1000 |
| 10 | #1000 | W14 | P1200 |
| 11 | #1200 | — | P1500 |
| 12 | #1500 | W10 | P2000 |
| 13 | #2000 | W7 | P2500 |
| 14 | #2500 | W5 | — |
| 15 | #3000 | W3.5 | — |
| 16 | #4000 | W2.5 | — |
| 17 | #6000 | W1.5 | — |
| 18 | #8000 | — | — |
Primary Applications
Silicon Wafer & Sapphire Dicing
Green SiC powder (F400–F1200) is the standard abrasive for wire-saw cutting of semiconductor wafers and sapphire substrates. Tight PSD control ensures consistent cutting speed and minimal subsurface damage.
Hard Material Surface Finishing
Fine SiC micro powders (#800–#3000) deliver precise surface finishing for tungsten carbide, hardened steel, glass, and ceramic substrates. Consistent morphology ensures uniform lapping results.
Tap Hole Clay & Kiln Furniture
Black SiC powder (80–90% grades) is a key ingredient in tap hole clay for blast furnaces, crucibles, ramming mixes, slide bricks, and kiln furniture. SiC enhances heat resistance and erosion durability.
Bonded & Coated Grinding Wheels
SiC powder (F8–F1500) serves as the core abrasive grain for bonded grinding wheels, cutting discs, coated sandpaper, and sanding belts. Both Black (cost-effective) and Green (precision) options available.
International Standard Compliance
FerrumX SiC grit is graded in accordance with four international abrasive standards—ensuring predictable performance across global manufacturing systems.
Bonded abrasive grit standard ISO 8486-1:1996 · F8–F220 macro, F230–F1500 micro
Coated abrasive grit standard ISO 6344-1:1999 · P12–P220 macro, P240–P2500 micro
Japanese Industrial Standard #16–#220 macro, #240–#3000 micro
China National Standard F4–F220 macro grits, W63–W3.5 micro
Why Choose FerrumX SiC Grit
FerrumX is positioned at the center of China’s silicon carbide production ecosystem, giving us direct access to high-purity quartz resources, cost-efficient electricity, and a highly skilled workforce. With a fully integrated supply chain—from raw material selection and Acheson furnace smelting to crushing, grading, and micro-powder production—we maintain complete control over quality and consistency. Our continuous investment in technology, automation, and strict QC systems ensures that every batch of SiC meets the performance requirements of abrasives, refractories, and metallurgical applications worldwide.
Our SiC production benefits from a stable, high-purity quartz supply, ensuring consistent furnace chemistry and long-term material reliability.
SiC smelting is energy-intensive. Our access to low-cost, stable electricity enables predictable production and competitive pricing without compromising quality.
From SiC crude →abrasives → micro grits → powder, we control every stage in-house. This ensures traceability, consistency, and flexible lead times.
Over years of SiC smelting and milling experience, our engineers understand furnace behaviour, impurity control, particle-size engineering, and application-specific requirements.
Ball mills, jet mills, magnetic separators, and air classifiers enable tight particle size distribution and reliable performance across batches.
Chemical composition, PSD, density, magnetic impurities, and morphology are monitored through each production stage to meet industrial standards.
We supply SiC tailored for abrasives, refractories, and metallurgy—with grades engineered to match customers’ process conditions.
With long-term international customers in steel, abrasives, and refractory industries, we maintain stable production capacity and export logistics.
The combination of resource advantages, integrated production, technical capability, and stable energy supply allows us to offer reliable quality with competitive pricing.
Laser PSD Verification
10 Purity Grades
Black + Green Options
Magnetic Separation
Safety Screening
FerrumX Silicon Carbide Production Equipment
FAQ
Frequently Asked Questions
SiC micro powder is the finest form of silicon carbide, produced by precision milling of selected SiC crude using ball mills or jet mills, followed by air classification to achieve narrow particle size distributions. F8–F1500 (FEPA) and P8–P1500 grit ranges correspond to particle sizes from ~3.5mm down to sub-3μm. Laser PSD analyzers provide closed-loop size control, and magnetic separation eliminates iron contamination. Safety screening removes all coarse particles for batch uniformity.
Black SiC powder (60–98% purity) is produced from silica sand + petroleum coke, offering cost-effective performance for bonded/coated abrasives, refractory, and metallurgical applications. Green SiC powder (97–99.5% purity) is produced with NaCl catalyst, yielding higher hardness (Mohs 9.4–9.5), superior chemical purity, and tighter PSD control—preferred for wire-saw cutting of semiconductor wafers, precision lapping, and high-end ceramic applications. Green SiC typically costs 2–5× more per ton.
FerrumX SiC powder covers FEPA-F grits F8–F1500, FEPA-P grits P8–P1500, JIS standard sizes #240–#8000, and GB W-standard sizes W63–W1.5. Purity grades range from 60# (60% SiC, metallurgical) to 98# (98% SiC, precision abrasive). Custom particle size distributions and blended grades available on request.
FerrumX uses laser PSD analyzers for in-line particle size measurement during milling and air classification. Closed-loop control adjusts milling parameters and classification settings in real time. Safety screening eliminates all coarse particles. Additional QC includes chemical composition analysis, density measurement, magnetic impurity testing, and morphology inspection per batch.
Green SiC micro powder (97–99.5% purity, F400–F1200) is the standard abrasive medium for wire-saw cutting of silicon wafers, sapphire substrates, and other hard crystalline materials in semiconductor manufacturing. Tight PSD control ensures consistent cutting speed, minimal subsurface damage, and wafer surface quality.
Black SiC powder grades: 60# (60% SiC) through 98# (98% SiC). Higher grades (95–98#) for abrasive and precision; lower grades (60–85#) for refractory and metallurgical. Green SiC powder grades: GC 97 (97%), GC 98 (98%), GC 99 (99% SiC) for semiconductor and precision applications.
